UIS Technologies successfully developed Mirror Surface Technology for our CMP retaining rings, this technology allows retaining rings to be tested under monochromic light that able to show the excellent result with 2 light bands. This technology helps customer to achive cost efficiency because it enables users to skip break in process and show excellent quell rate before running the actual CMP process. Newly assembled retaining rings are required to go through break inprocess before put into use in actual wafer polishing process. With UIS Mirror Surface technology, customers can save a lot of time and money by implementing Plug & Play directly into wafer polishing process without going through break in process. As results, we able to improve customers’s CMP cycle time, productivity and at the same time prolonging tool life such as polish pad